Wetting Behavior of Borosilicate Glass on Kovar Alloy 硅硼玻璃在可伐合金表面的润湿规律
Power Injection Molding of a Kovar Alloy Kovar合金的粉末注射成形工艺研究
The existing problems of electroplating technology for electrical connector after glass sealing with KOVAR alloy as substrate were presented, such as overstepping contact body size, decreasing insulating property and poor corrosion resistance, for which the reasons were analyzed. 提出了可伐合金玻璃封接电连接器电镀工艺存在的问题:接触体尺寸超差、绝缘性能下降、抗蚀性差等,并对其原因进行了分析。
Thermal Expansion Behavior of Copper/ Kovar Alloy Composite 可伐合金与铜复合材料热膨胀特性
Research on Powder Injection Molding of Kovar Alloy Kovar合金注射成形技术的研究
Through an analysis of the micro-properties of stress corrosion fracture of Kovar alloy, the paper proves that this alloy is a material sensitive to hydrogen brittleness and that the more the concentration of H+ and Cl-, the easier the occurrence of the corrosion fracture. 本文通过对可伐合金应力腐蚀断口的微观特征的研究,证明了可伐合金为氢脆敏感性材料,H+、Cl-浓度增加,合金易发生腐蚀开裂。
The effect of the Electroless Plating Quality to the Stress-corrosion Fracture of Kovar Alloy 柯伐合金应力腐蚀与电镀层质量的关系研究
Package boxes of Kovar alloy were fabricated by powder injection molding process starting with powders of Fe, Ni, Co, and a wax-based polymer was selected as binders. 以Fe粉、Ni粉和Co粉为原料,研究了利用注射成形技术生产Kovar合金封装盒体的工艺。
Oxidation behavior of kovar alloy in N_2/ H_2O atmosphere under simulated field condition 可伐合金在模拟现场N2/H2O二元气氛下的氧化行为
Mechanism of Anodic Bonding between K4 Glass and Kovar Alloy K4玻璃与可伐合金的阳极焊机理分析
A study on the leaching process with sulfuric acid and sulphate solutions for recovering valuable metals from scraps of the kovar alloy Kovar合金废料用硫酸及硫酸盐溶液浸出回收有价金属
Anodic Bonding for Monolithically Integrated MEMS Mechanisms of anodic bonding between borosilicate glass and Kovar alloy 单片集成MEMS中的阳极键合工艺硼硅玻璃与Kovar合金阳极键合机理分析
We have discussed the spectrums of 4J-29 Kovar alloy in different technical process and found that the soft X-ray appearance potential spectrometer can be used to detect the process in which the carbon is released on kovar alloy surface. 通过对4J-29可伐合金不同工艺处理后所测得的软X射线出现电势谱(SXAPS)进行分析对比,找到了利用软X射线出现电势谱作为监控可伐合金脱碳工艺质量的途径。
The results show that intimately contacted area between Kovar alloy and the glass enlarges from initial contact area with increase of bonding time. 结果表明,玻璃与可阀之间的紧密接触面积随连接时间的延长从初始接触区域开始逐步扩大。
Kovar is an alloy widely used for making glass-to-matal vacuum-tight seals. The spectra of its surface elements obtained by the resonant photoelectron appearance potential spectroscopy ( RPAPS), the Auger electron spectroscopy ( AES) and the X-ray photoelectron spectroscopy ( XPS) have been compared. 用共振光电子出现电势谱(RPAPS)对真空封接用可伐合金的表面进行了分析,并与俄歇电子谱(AES)和X射线光电子谱(XPS)进行比较。
Studies on the micro-properties of stress corrosion fracture of Kovar alloy 可伐合金应力腐蚀断口的微观特征研究